PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...

Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...

Ansys has announced that it has achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This will enable mutual customers to ...

Ansys (ANSS) and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips The ...

PITTSBURGH, March 10, 2020 /PRNewswire/ -- The EDF Group (EDF) is digitally transforming to drive the development of safe, dependable and affordable low-carbon power generation technologies by ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...

PITTSBURGH, Pa., July 18, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) is collaborating with Supermicro and NVIDIA to deliver turnkey hardware, enabling unmatched acceleration for Ansys multiphysics ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...

(NASDAQ: ANSS ) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration ...