Building reliable, high-speed memory interfaces target FPGA I/O structures as well as intellectual property (IP) used within design software to allow rapid configuration of memory interfaces. These ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the expansion of its DDR5 memory interface chip ...
In the relentless pursuit of higher performance at a system level, Integrated Device Manufacturers (IDMs) have become well versed in developing digital interfaces that are able to operate at high ...
What are the current challenges involved with incorporating sufficient HBM into multi-die design? How a new interconnect technology can address the performance, size, and power issues that could ...
Memory infrastructure gets a boost: OpenCAPI and its OMI subset, along with the CXL, ratchet up performance to address near-memory domain bottlenecks, while Gen-Z focuses on rack and data-center scale ...
Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires ...
Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...
Many factors are driving system-on-chip (SoC) developers to adopt multi-die technology, in which multiple dies are stacked in a three-dimensional (3D) configuration. Multi-die systems may make power ...
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