ANSAN, South Korea--(BUSINESS WIRE)--Seoul Semiconductor Co., Ltd. (KOSDAQ 046890), a leading global innovator of LED products and technology, announced that it has introduced high-power LED package ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
LED manufacturers are experts regarding the thermal design inside of the LED package. They can provide the relevant data to describe the thermal performance, and they also have good ideas about how an ...
Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...
OSRAM Opto Semiconductors now offers the Advanced Power TOPLED line of LEDs incorporating the company’s ThinFilm technology. These new products broaden OSRAM's high-power, surface-mount LED product ...
LuxLEDs combine high-level illumination with low-power consumption and are available in three different surface-mounted packages. Axial intensities are as high as 24,000 mcd with flux levels to 120 mA ...
Knowing the exact requirements of an application and understanding performance characteristics will help you to avoid common pitfalls when purchasing high-brightness LEDs. Mike Godwin and Gunnar Klick ...
With an eye on consumer electronics, the company's latest RGB, super-luminosity, tough-and-flush (TAF) LEDs and surface-mount chip LEDs promise brighter lights in smaller packages. The three-die TAF ...
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