Electronic Design

Four-Pin TO Type MOSFET Package Lowers Switching Losses

For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
EDN

AOS adds advanced MOSFET packages

Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...
Electronic Design

Leadless Power Package Cuts SO-8 Down to Size

Now available from multiple sources, a 3.3-mm x 3.3-mm MOSFET package reduces pc-board space requirements by up to 63% versus the SO-8, while offering similar thermal and electrical performance. Spiro ...
Nasdaq

Alpha and Omega Semiconductor Adds Two New Advanced MOSFET Package Options for High-Current Applications

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...
EDN

Chip-scale powers MOSFET packages

The best-performing and most cost-effective power MOSFETs might well turn out to be those having no package at all. With power-MOSFET silicon now largely optimized, manufacturers are quickly ...
Electronics Weekly

ST licenses Mosfet thermal package

STMicroelectronics has licensed a power Mosfet packaging technology from US firm Siliconix which is designed to offer improved heat dissipation characteristics. “With the size of DC-to-DC power ...