The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...

What if your AI could remember every meaningful detail of a conversation—just like a trusted friend or a skilled professional? In 2025, this isn’t a futuristic dream; it’s the reality of ...

Micron Technology, Inc. and other memory companies have substantial inventories to work through, as revenues plummet. The logic/foundry IC sector will not exhibit the revenue plunge in 2023 as will ...

Note: Removal of CeraMemory and CeraTape per company request. This article discusses two interesting memory (and spin-based logic) announcements. At the 2023 SNIA Storage Developers Conference (SDC) a ...

True 3D-ICs, where a memory die is stacked on top of a logic die using through-silicon vias, appear to be gaining momentum. There are a couple reasons why this is happening, and a handful of issues ...

In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories and logic IC are ...